Photoresist Process Technology

APT, a long-standing manufacturer of automated chemical processing systems, has teamed with a start-up company, MCSI, to commercialize research done at Stanford University on advanced thermal processing modules. This technology, patented (pending) and licensed by Stanford to MCSI, achieves parallel closed-loop temperature control at each 25mm field of the substrate, representing a 10X improvement in spatial controllability compared to conventional multi-zone heating plates.

Dr. Charles D. Schaper of Stanford University and President of MCSI says, "It’s exciting to see the university research transitioned to a real-world product that can provide tremendous benefits to those applications requiring tight control of temperature and temperature uniformity."

He adds, "By coupling the technology with advanced process control software, improvements to linewidth control and characterization can be achieved to enable new materials, increase yield and reduce cost."

"We believe that this is a true breakthrough in photomask and wafer processing," says Dale Morsette, General Manager of APT. "The timing of this technology is perfect to meet the needs of new photoresists requiring the utmost in temperature control and uniformity. By also tightly controlling the temperature spread during transitions, which this technology allows, the entire heat spectrum to which the substrate is exposed is under the Process Engineer’s control."

APT of Fremont, CA manufacturers and markets the new integrated hot/chill plate systems in conjunction with its line of automated chemical processing systems for Coat/Bake, Develop, Etch, Strip and Clean of photomasks and low volume substrates. The product contact point at APT is Dale Morsette who can be reached at 510-360-9560, or dalem@aptsystems.com.