COMMON FEATURES

• Simplicity = Reliability
  
• Effective Chemical Drain Diversion
  
• Up to 6 nozzles for Chemistry + Top Side Rinse
  
• Automatic Chamber Rinsing using 10 nozzles
  
• Uniform Process Airflow
  
• Recessed Spray Nozzles, optional Drain Diversion
  
• Optional Automated Substrate Handling
  
• Interconnect capability between modules

SAFETY FEATURES

• Notification When Beneficial; Hard Shutdown Only When Necessary
  
• Extensive Safety Interlocking Through both Hardware and Software
  
• Double Containment for Chemistry
  
• Total Isolation of Chemicals and Electronics
  
• Anti-Splashback Design
  Protection for Operators

FLEXIBILITY

• Systems Dedicated to a Single Process, or Combination Systems Performing Multiple Processes
  
• A Wide Variety of Options to Customize the System for Your Application(s)
  - Binary, Fan, Stream and/or High Pressure Jet Nozzles
  - Variety of Canisters, Pumps, Exhausts, Drains, Brushes, etc; with or without Chemical Temperature Control

SIMPLICITY/RELIABILITY/ SERVICEABILITY

• Elegantly Simple Design
  
• Standard Parts Used Throughout
  
• Field-Proven Reliability
  
• Easy Access to All Areas for Maintenance/Service
  
• Password Protected Screens
  
• Protection Against Operator Error
  

MODEL 3110
CLEANER

Applications:

- Organic Clean

• H₂SO₄ and H₂0₂
• Acid Clean
  
• Hot DI H₂0 Rinse
  
• Neutralizer Topside and Backside
  

- Particulate Clean

• High Pressure Jet
  
• DI H₂0 Rinse
  

- Final Clean

• Surfactant Spray
  
• Bi-Directional Brush
  
• DI H₂0 Rinse
  

- Spin Dry

- Automatic Chamber Rinse before next substrate processed

MODEL 3140 DEVELOP, ETCH or STRIP SYSTEM

Applications:

- Spray Develop for Laser Exposed Positive Resist

- Spray Etch of chrome

- Resist Strip

• Chemical Dispencse Using Fan or Binary Nozzle(s)
  
• DI H₂O Rinse Using One or Two Fan Sprays
  
• Spin Dry

- Automatic Chamber Rinse before next substrate processed

MODEL 3140 DEVELOP and ETCH SYSTEM

Develop/Etch Process:

• Spray Develop Using Fan or Binary Nozzle(s)
  
• DI H₂O Rinse Using One or Two Fan Sprays
  
• Rinse Develop Nozzle(s) and Chamber Rinse
  
• Spray Etch Using Fan or Binary Nozzle(s)
  
• DI H₂O Rinse Using One or Two Fan Sprays
  
• Spin Dry

- Automatic Chamber Rinse before next substrate processed